Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten
They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b
Electronics Forum | Thu Sep 24 11:09:02 EDT 2015 | proceng1
We are looking at buying a used HELLER 1800 reflow oven. It is currently set up for 480v and our facility is 208v. I know we can either get it retrofitted or buy a step up transformer. Is retrofitting the machine simply moving a tap on the inter
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Wed Jan 05 14:21:27 EST 2000 | Glenn Burson
I have the opportunity to pick up a used 1998 Heller 1900WN reflow. I have no experience working with Heller reflows, nor have I heard much about them, so I don't know if they are good quality machines or not. I have concerns about issues such as z
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Mon Jun 16 12:06:52 EDT 2008 | realchunks
Seen this with our old board house. The uncured board is causing your problem. Hard to catch, but looks like you have all your ducks in a row. We presented the exact same thing to our board house, and naturally they blamed our process, handling, a
Electronics Forum | Tue Jan 14 17:22:16 EST 2020 | emeto
Avillaro, would you say that vapor phase process was selected, because the boards are so thick and heavy? I would assume so. Have you ever tried to run them through reflow oven? To understand better your challenge, we need to understand the setup be
