Electronics Forum | Mon Aug 28 07:28:07 EDT 2006 | davef
Mr Jarvis One experience with black pad makes you promise never to use ENIG again. It's nice that you have a supplier that has avoided that problem.
Electronics Forum | Mon Nov 13 13:45:17 EST 2006 | russ
See now? all this talk here could easily be avoided by using vitronics!! hahahahahaha personally I think Heller and BTU both leave much to be desired. No, I do not work for vitronics OR fastek! hehe
Electronics Forum | Tue Nov 14 01:28:10 EST 2006 | CHITRA
When we reflow solder SMT PCB with SMT Electrolytic capacitor- 5MM sized ,the capacitor gets burst and all other adjacent and surrounding components also get disturbed. What could be reason for this. What should be done to avoid this problem.
Electronics Forum | Fri May 11 04:09:43 EDT 2007 | pima
Larry I checked archive but I didnt find any satisfaction answer. Maybe u can help me? Something telling what should operator do to avoid bend leads in IC components - I m talking about handling dangerous. regards peter
Electronics Forum | Fri Jul 06 15:45:50 EDT 2007 | hussman
I have to agree with the fat green guy. And with Real Chunks too. You should also run a matte mask on your board. This will help in preventing shorts.
Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw
Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!
Electronics Forum | Wed Sep 03 11:52:58 EDT 2008 | stepheniii
But Vlad was talking tin and Davef gave intermetalic thicknesses which Vlad said needs to be avoided by having a few microns of tin. I'm not 100% sure but I suspect that DaveF is not convinced that Vlad knows what "intermetalic" means.
Electronics Forum | Mon Jan 26 11:18:10 EST 2009 | evtimov
It seems like your parts are acceptable regarding IPC610. I would't bother if all in the specs. But the question is why you damage your partss in P&P process. I think you should avoid that instead of looking for standards. Regards, Emil
Electronics Forum | Tue Apr 21 16:33:06 EDT 2009 | llaerum
Home plate design is great for avoiding beads and tombstoning in some cases, but it will not help you when the spacing is too far apart. It will make it worse. You need a good even screen and accurate placement.
Electronics Forum | Tue Apr 28 07:45:07 EDT 2009 | davef
When using high tin solder, doesn't proper specing to avoid the effects of tin whiskers become at least as large an issue as proper specing for defect-free wave solder processing?
