Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper
| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an
Electronics Forum | Wed Jul 21 12:41:39 EDT 1999 | jason
I have pcb's in which i am experiencing warping. the boards are 12.8125" on a diagonal measurement. they are out approximatley .010". the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the propper fo
Electronics Forum | Fri Apr 19 13:47:00 EDT 2019 | davef
It's a terrible idea. Through holes should be drilled in the exact center of a pad +/-. Have the two holes go out back and settle this. Whichever hole returns, that hole get to keep the pad. The other hole needs to get its own pad. End of story. Th
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
Electronics Forum | Wed Sep 13 14:55:58 EDT 2000 | Mark S
Hi All -- I have read the IPC acceptability requirements of butt-joints, but haven't seen anything on how they're actually performed. I'm assuming we can trim a DIP package, and place the part onto paste immediately before relow (or hand-solder it l
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Sat Aug 22 12:18:12 EDT 1998 | Tryin'
| Board shops and us, the user, have a lot on our hands. As far as getting traces - this is done using an etch resist before solder mask and the HASL processes are performed. So when in the process is HASL performed?? | With tin/lead plated boards,
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
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