Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec
Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als
Electronics Forum | Sat Jan 06 02:12:36 EST 2007 | backbenchers
i have 1 customer using our reflow oven, he is facing the problem that after taking the boards from reflow oven ICs & some resistors felt down.they are using our glue dispenser also, the glue is not fixed with the component. wht will be the solution
Electronics Forum | Tue Aug 12 08:34:31 EDT 2008 | rameshr
hai, in our smt process we are facing the following problem. The Case A tantalum capacitor used in our PCB assembly - during reflow process get shifted, due to which other components nearby that also found missing. what are the causes for this proble
Electronics Forum | Tue Jan 23 10:24:48 EST 2007 | d0min0
Hello, for 1 year we are using meshed stencils and us cleaner, and suddenly we faced few stencils glued off the mesh... anyone can comment this phenomenon? is this safe? or you also had problems with such configuration regards
Electronics Forum | Mon Feb 05 12:57:35 EST 2007 | cyber_wolf
Take the nozzles out and let the indicator tip touch the metal face the nozzle pushes up into. This will tell you whether the variation is in the shaft or the nozzles. Also while your indicator is touching the holder, manually grab the shaft assy a
Electronics Forum | Thu Feb 22 19:37:48 EST 2007 | vshan
Hi All im facing an issue with my DEK. Once the middle sensor detects the board, the stopper does not able to stop the board on time. i have checked all the basic parameters. Can anyone help me rgd vshan
Electronics Forum | Fri Mar 30 23:07:13 EDT 2007 | mika
And how about the queston: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11592&mc=7 We face a big problem with this matter right know. /
Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638
7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.
Electronics Forum | Mon Jan 28 07:29:33 EST 2008 | davef
Se�or Tech: I wouldn't be able to keep a straight face making a presentation on a topic like that one.
Electronics Forum | Tue Apr 29 02:08:21 EDT 2008 | sin4d
Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks
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