Electronics Forum | Wed Oct 20 16:55:26 EDT 1999 | NickMata
Hello all, I am trying to get some information on ENTEK CU56. I am planning to use 310M flux on ENTEK 56 cards. It will not be a double reflow (top/bottom) followed by wave. I plan to reflow, glue/cure then wave. I am concerned about burning off the
Electronics Forum | Fri Mar 04 17:19:31 EST 2005 | davef
Mrduckmann2000: Why do you want to do this? * Removing a non-washable / peelable temporary solder resist [TSR] is going become very tedious, because they do not release well from small / tight / isolated features. * Clay from washable resists will
Electronics Forum | Mon Feb 26 14:15:21 EST 2001 | marting
Steve, Currently we are using selective pallets and the best piece of advice is to find a supplier that will be able to handle the requirements of the selective wave process, for example proximity of chips to PIH devices, and pallet thickness etc. We
Electronics Forum | Fri Oct 08 09:08:32 EDT 2004 | russ
I've never had one "float" in the wave. Have you tried waving yet to see? Anyway, glue would work, or you could place a a small weight on top, or clinch a couple of leads. Russ
Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Tue Oct 11 18:52:19 EDT 2016 | davef
Reflow => Top side DIP => Bottom side glue => Bottom side SMT => Wave solder ... We couldn't keep the DIP clinch apparatus away from the bottom side SMT if we did the bottom side SMT prior to DIP.
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Sun Apr 21 09:34:03 EDT 2002 | hany_khoga
Dear all: We need to glue some chip capacitors (0603 & 0805) before continuing the process of placing the topside SMT components. As a subcontractor we received the whole materials including the glue. After experimenting several temperature profiles
Electronics Forum | Wed Feb 21 08:48:37 EST 2007 | rgduval
Ideally? Never. You risk component break down by re-running the board over the wave machine. In a perfect world, your wave operator would make adjustments after one run, and you'd run another panel over the wave to judge the effectiveness of the a
Electronics Forum | Tue Aug 14 10:51:18 EDT 2007 | erhard
standard procedure for this would be to solder SMDs on the bottom side and the LEDs all at once on the wave - if the layout is ok for the wave. You would have to glue the SMD components, for this you would have to use a glue dispenser or a special hi
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