Electronics Forum | Wed Jan 18 08:34:09 EST 2006 | Nathan
We are designing a new in-line inpsection station for PCBAs and I am a little confused about how to interpret two the Mech. Interface standards in SMEMA 1.2 (items 5 and 6). What is exactly meant by "maximum gap"? Does this get at the distance betw
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Wed Feb 07 16:20:46 EST 2007 | davef
Bismuth is a low-melting metal with poor mechanical properties; if you melt the bismuth wire into a standard tin-lead solder joint, then the bismuth alloys with the solder, and forms a material that will crumble if you scrape it with your fingernail.
Electronics Forum | Wed Apr 25 08:40:45 EDT 2007 | avalancher
I've also found that mechanical feeders require much more maintenance than the 'smart' magazines do. Also remember that 'smart' magazines also give you the opportunity to change the setup quickly if necessary, and swap feeders if all can't fit on th
Electronics Forum | Fri May 11 07:38:14 EDT 2007 | tombr
It is possible to vary the length of lead during auto insert. However, it requires software and mechanical adjustments. Universal equipment allows small changes via software program for lead length. To change angle of clinch involves a mechanical a
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Wed Jan 27 11:22:51 EST 2010 | fredc
Hello TQS, We have made Micro Mechanics adapters for Mydata. The Micro Mechanics tips are used in die bonding machines. I have no doubt that an adapted nozzle would hold your die securely. From Grants posts in the past, he had problems with placement
Electronics Forum | Tue Aug 03 11:40:41 EDT 2010 | swag
HSP nozzles get pushed back up into the head by a cam with a pneumatic brake on it. Make sure this is functioning properly. It is not uncommon for the MAC valve that actuates the brake to get flaky = replace it. Also, the nozzles are mechanically
Electronics Forum | Fri Jan 14 12:20:12 EST 2011 | SheanDalton
There is a lot of information available about cleaning no-cleans. Takes chemical, mechanical and thermal energy. Find the right chemistry for the flux (not something like IPA that will most likely just smear the residues around and cause problems
Electronics Forum | Fri Jan 16 16:01:31 EST 2015 | emeto
GSMs are great machines for many parts, but for the small parts you should look for something better and more contemporary. As it was mentioned in one of the previous posts, the feeder is a big key. I don't think there is feeder for GSM that can supp
