PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/PADS-Standard-Layout.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Pantheon.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Proteus.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Pulsonix.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/SoloPCB.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Ultiboard.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Xpedition.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/eCADSTAR.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | http://www.pcblibraries.com/products/fpx/altium.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/DipTrace.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
