Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Electronics Forum | Tue Apr 05 07:46:47 EDT 2005 | py
lead free plating can create whiskers. you might use dim sn/ag/cu .
Electronics Forum | Tue Aug 22 09:49:39 EDT 2000 | galltp
Dr. Lee, We have seen a small decrease in shear strength for Pb/Sn plated components attached with Sn/Ag/Cu solder compared to components with a Pb-free finish. With the jump in the cost of Pd, we are struggling to define a practical Pb-free
Electronics Forum | Thu Jun 21 00:23:55 EDT 2001 | Robert Sykoh
Hi, I am looking into lead free process. Do anybody has experience?? The composition used in SMT & wave. I heard Sn,Ag,Cu & Sn,Ag,Cu,Bi. What are the major differences and concerns. Besides, what are the capital investment required?? Any advice is
Electronics Forum | Thu Jul 01 17:35:30 EDT 2004 | Sofia
Hi Everyone, I am just curious, is there a guidline that people follow for choosing their lead-free solder paste? In other words, how do people know whether they should use Indium alloy, or Castin (Sn/Ag/Cu), or whatever else? Thanks
Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony
I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Tue Oct 05 10:38:43 EDT 2004 | palmerg
Major Japanese OEMs investigated numerous lead-free alternatives, including alloys containing bismuth and/or zinc, such as Sn/Ag/Bi/Cu, Sn/8Zn/3Bi and Sn/58Bi. However, over time, the Japanese industry has moved toward Sn/Ag/Cu alloys. The Japan Elec
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
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