Industry News: solder and ball and gap (Page 9 of 16)

Comtree to Represent Ersa’s Rework and Selective Solder Equipment at EPTECH Edmonton

Industry News | 2017-03-01 11:14:42.0

Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit with Comtree at EPTECH Edmonton, scheduled to take place Tuesday, March 7, 2017 at the Doubletree by Hilton in Edmonton, AB. EPTECH Edmonton is one of several regional professional electronics shows produced in major high-technology centers across Canada. It is the only series of coast-to-coast national electronics shows in Canada.  

kurtz ersa Corporation

Comtree Shows Ersa Rework, Inspection and Soldering Equipment at EPTECH Calgary

Industry News | 2017-03-01 13:29:58.0

Kurtz Ersa North America is pleased to announce that it will exhibit with Comtree at EPTECH Calgary, scheduled to take place Thursday, March 9, 2017 at The Coast Plaza Hotel & Conference Centre in Calgary. The EPTECH shows are regional professional electronics shows produced in major high-technology centers across Canada. Comtree is Ersa’s representative in Canada.  

kurtz ersa Corporation

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

Ersa to Highlight the Smartflow 2020 and HR600 at SMTA Expo

Industry News | 2015-04-28 18:23:44.0

Kurtz Ersa North America is pleased to announce that it will exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 5, 2015 in Livonia, MI. Company representatives will discuss the complete Ersa product line, including the new Smartflow 2020 selective soldering system and HR600 hybrid rework system.

kurtz ersa Corporation

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2011

Industry News | 2011-05-11 18:59:27.0

May 11, 2011 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Microelectronics inspection capabilities at Nepcon China in Shanghai from May 11th to May 13th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at booth 4E23 Level 1B East Hall.

Machine Vision Products, Inc

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2012

Industry News | 2012-04-24 06:53:22.0

April 24, 2012.Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.

Machine Vision Products, Inc

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2012

Industry News | 2012-04-24 08:13:12.0

April 24, 2012 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.

Machine Vision Products, Inc

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Industry News | 2012-06-01 09:09:55.0

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.

Practical Components, Inc.

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation


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