Electronics Forum | Mon Oct 02 13:04:54 EDT 2023 | proceng1
I did a post a while back about this with Selective. I don't recall all the details now, but you can search it.
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward
Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr
1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Fri Apr 23 15:10:45 EDT 1999 | Chrys Shea
| We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be ens
Electronics Forum | Thu Apr 29 16:56:16 EDT 1999 | Kevin Hussey
| | We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be e
