Electronics Forum | Wed Jul 03 14:16:09 EDT 2013 | horchak
Hi, I had seen your post earlier but had lost my very old log on information. First I will say that BGAs should never be placed and re-flowed with a rework station unless there is absolutely no other option, so I don't understand why your assembly ho
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf
The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in
Electronics Forum | Wed Jan 27 17:32:51 EST 2016 | billthebuilder
We do High Mix, Low Volume and are looking for the best inline AXI with the criteria of industry-leading automation capabilities. The abilities to program offline, automatic conveyor width adjustment and board alignment are important to us. We want t
Electronics Forum | Fri Dec 01 15:06:54 EST 2017 | emeto
I am not sure that is doable. Ground Aperture is very small(for the stencil blade to get in there) and very close to the other apertures. I want to say the minimum requirement for step is 6mm clearance from other apertures for the stencil houses that
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Thu May 23 15:29:57 EDT 2019 | toms
Sorry for switching accounts, the SMTA interface was not giving me the option to add attachments. Evtimor - IC testing of some samples of different assemble holes and components leads did not yield anything abnormal. SEM EDX of the unsoldered lea
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Tue Aug 18 16:16:36 EDT 2020 | charliedci
We have a Glenbrook Jewel Box 70T, purchased about 5 years ago, Think it was around $60K quoted price (we traded in our old Glenbrook for a discount), Software pretty basic, can store images and has some graphics and image processing capability. It h
Electronics Forum | Tue Aug 18 20:57:15 EDT 2020 | dwl
Specs like beam voltage, current and focal point size are important considerations for image quality and you can spend hours going down the rabbit hole learning about them. Fundamentally, what really matters is if you can get an image clear enough to
