Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Wed Aug 25 10:09:15 EDT 1999 | ray hare
| | Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. | | | | At
Electronics Forum | Wed Aug 25 10:51:55 EDT 1999 | Peter Barton
| Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. | | At a dif
Electronics Forum | Thu Aug 26 18:23:21 EDT 1999 | Chad Haima
| Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. | | At a dif
Electronics Forum | Mon Aug 23 10:34:09 EDT 1999 | Greg Jones
I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ramp
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon
| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE
Electronics Forum | Thu Aug 19 10:36:53 EDT 1999 | John O'Brien
| CAN ANYBODY ADVISE ME AS TO INDIVIDUAL PCB IDENTIFICATION THROUGH ASSEMBLY - THE PROS AND CONS | | THANKS | Leo: I have been doing a bit of research on this topic recently. I would be glad to discuss it with you. It seems the best technology is
Electronics Forum | Tue Aug 17 19:42:28 EDT 1999 | Carlos Palacios
| Looking for users of the Emerald pick and place.Comments on that equipment would be greatly appreciated. QFP and micro-BGA placement, idiot proff software etc. | | We just got a good offer to use that equipment for our training center instead of o
