Electronics Forum | Fri May 22 16:14:45 EDT 1998 | Earl Moon
I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon
Electronics Forum | Sun May 31 16:00:33 EDT 1998 | Eric
Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric
Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell
We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls
Electronics Forum | Thu Apr 09 15:44:36 EDT 1998 | Earl Moon
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? It depends on what you intend inspecting. For dimensional and tolerance measurements, I have used optical comparators. For solder ball voiding, X-Ray is used.
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F
| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Mon Jan 12 12:16:18 EST 1998 | Alan Bryan
Does anyone have any information on reballing BGA devices? I'm looking for specs, a process flow, and what tests should be performed afterward. Also, I'm looking for any companies that contract this service. Thanks.
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Tue Dec 23 01:25:38 EST 1997 | J.H Kim
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly.
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
