Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Thu Dec 09 17:34:27 EST 2004 | Charles Brown
I'm looking for an industry standard for naming of surface mounted devices. What does the everyone use? ex. IPC-SM-1206-06 Is this and acceptable convention?
Electronics Forum | Fri Dec 10 13:54:49 EST 2004 | greg
Hallo I am going to prepare our SMT and THT production to meet ESD protection. Could you please point some information theoretical and practical about ESD. Any web site, documentations which is important (standards-IPC), really worth books will
Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC
Check IPC-7095, 7.4.1.6 For Class 2, 45% of the diameter adn 20.25% for the area.
Electronics Forum | Wed Dec 15 12:47:59 EST 2004 | DasonC
Recommend to check http://leadfree.ipc.org I agreed the lead free is a must for environmental and human health. Not sure how soon they can found out another harmful material
Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC
Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4
Electronics Forum | Wed Dec 22 21:14:53 EST 2004 | davef
IPC-FA-251 recommends 121*C for 30-60 minutes for 1 and 2 flex layer circuits. A rigid flex can take easily an hour per layer depending on the construction.
Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS
Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS
Electronics Forum | Mon Jan 03 14:10:02 EST 2005 | scotceltic
Can anyone tell me what type of material that the standard IPC SMT trays are made of ?? I am trying to mill some out however I need to order the correct ESD safe material ??
Electronics Forum | Tue Feb 08 19:44:31 EST 2005 | Dreamsniper
Is there IPC Standards that I could use with the following evaluation: a) Solder Paste Printing Performance b) Solder Paste Wetability What standards do you use or criteria when you evaluate solder paste with the above performance? thanks and r
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