Electronics Forum | Thu Feb 25 10:11:08 EST 1999 | Joe Cameron
Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts a
Electronics Forum | Wed Feb 24 01:08:10 EST 1999 | Joe Cameron
Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean sock
Electronics Forum | Fri Feb 19 08:25:23 EST 1999 | Ryan
I'm a 19 Year old singaporean student. I need to do a report on solder paste dispenser. i've search the net but to to avail. Please help if you know anything about solder paste dispenser or have any info and pictures or charts of solder paste dispens
Electronics Forum | Thu Feb 18 08:35:10 EST 1999 | Dave F
| We have problems with solder balls after reflow. Anybody have any ideas as to what causes them? | Al: Tuffty's comments are good, but point to the broader problem in trying to make recommendations on your problem ... There's just not enough info
Electronics Forum | Mon Feb 08 16:12:36 EST 1999 | Leonard Levy
Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. Thanks,
Electronics Forum | Mon Feb 01 18:08:10 EST 1999 | Susan
Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder joints afte
Electronics Forum | Mon Jan 18 18:08:38 EST 1999 | Jerry Stafford
I know there was some discussion a few months ago on this topic but I don't think a good solution was offered for checking CpK using chips using a chip shooter. I am looking for a way to measure this on our Fuji CP6-4000. Any suggestions? Jerry
Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns
I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen
Electronics Forum | Fri Jan 08 16:31:05 EST 1999 | Jason Tomlinson
Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what acti
Electronics Forum | Fri Jan 08 06:49:23 EST 1999 | John W
I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). The one problem I still have is cleaning the wave solder carrier's to remove the no clean flux
