Electronics Forum: good (Page 870 of 1214)

Re: Siemens siplace for high mix/medium to low volume

Electronics Forum | Fri Jun 12 11:54:55 EDT 1998 | Rin Or

| I am currently in the process of trying to justify new equipment in my factory. I currently have Siemens siplace 15 series machines. I don't feel thins equipment is right for high mix/ medium to low Volume. I am running up against a in house con

Re: Siemens siplace for high mix/medium to low volume

Electronics Forum | Fri Jun 12 01:17:52 EDT 1998 | Erhard

Are you using extra feeder tables that you can setup off line and than just exchange for the ones you had in the machines for the previous batch? This way the Siplace should not be too bad. Otherwise for fast change and low volume you might look at m

Re: BGA Rework

Electronics Forum | Tue Jun 16 15:06:48 EDT 1998 | Bob Willis

I must say that I feel when the board has been correclty designed with corner marks on the edge of the BGA the optical systems are not necessary on 0.50/0.060" pitch. I like both air and IR the IR has the major benifit that you do not need all the ex

Re: Splicing tape for 8,12, and 16mm component tapes/How 'Bout Carrier Tapes?

Electronics Forum | Thu Jun 04 10:17:09 EDT 1998 | Eric Jenkins

| | Looking for vendors of splicing tape for 8,12 and 16mm tape and reel. | | Any net sources? | If you can use carrier (cover) tapes go see "Igmar Grewar 16:04:32 5/28/98" on SMTNet. Dave F It is very difficult to splice carrier tape, we have tried

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 16:14:04 EDT 1998 | Terry Burnette

| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F We've bee

Re: This is a Test... It Sure Is

Electronics Forum | Wed Jun 03 19:07:03 EDT 1998 | Steve Gregory

| | | | | | | | | | Hi there...I'm testing....is anybody else having problems posting messages?....this is a test... | | | | | | | | OOPS! I guess it's working now...hmmmmm... | | | Steve: Stop!!! Breath deeply. Good. Now is there anything you

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Minimizing Board Warpage During Reflow

Electronics Forum | Thu Jun 11 23:35:40 EDT 1998 | Scott McKee

| Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 14:35:05 EDT 1998 | Steve Gregory

| We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance Hello Ryan, There's a quite a few things that can cause solder bal

Re: Leader Tape for SMT components/Source, but why?

Electronics Forum | Tue Jun 02 17:52:06 EDT 1998 | Dave F

| Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. Igmar: The following companies supply SMT co


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