Electronics Forum | Tue Jul 24 20:00:40 EDT 2001 | davef
There is too little heat to make the solder flow properly. Test this theory by profiling on the pad where the solder doesn�t flow well. As the time after posting this thread increases, we generally propose additional theories. Rather than us specu
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
Electronics Forum | Tue Jul 31 17:16:07 EDT 2001 | davef
Two places to start your search are: 1 Look at last months "SMTnet OnBoard" Forum with Gil Zweig of Glenbrook Technologies. Gil presented his thoughts on the completary capabilities of xray and whatever he called the ERSA scope. 2 Review the fine
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Fri Aug 03 09:21:08 EDT 2001 | Ian T
hi my company is planing to purchase an aoi system to be used inline. is there anyone out there doing this, if so do you use all the machine options (pattern character recognition, bad board marks, correct part polarity...) or do you dumb it down(pa
Electronics Forum | Tue Feb 08 12:57:42 EST 2000 | Travis Slaughter
I have had the exact thing you describe happen to me, at least it sounds the same. On the PLCC there could be maybe 1 leg not soldered or many of them tending to be in groups but not necessarily. This happened on a established board that had always
Electronics Forum | Sun Feb 06 15:26:32 EST 2000 | Carol Zhang
I have a board which contains brass spacers. The spacers will pass through the wave during soldering. I found a silicon-rubber cap that can prevent solder climbing up into the spacer. However, the cap influence the wave flow and reduce the solderabil
Electronics Forum | Sat Feb 05 12:36:09 EST 2000 | Albert Hay
Hello everyone, I am cosidering the possibility of using Low-Melt solder for repair purposes. However, I am concerned about adding a new alloy (agent) to the board that already has the No-Clean solder on it. Also, is the Bismuth in the Low-Melt comat
Electronics Forum | Fri Feb 04 11:55:08 EST 2000 | Casimir Budzinski
I am looking for a faster way to trim component leads after wave solder. We now cut by hand, we have a Q-cuter but stoped using it the blades dulled quickly and left flags. we just got a cut and clinch locator and hope this will solve some of are pro
