Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall
| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so
Electronics Forum | Thu Sep 02 04:12:01 EDT 1999 | Wolfgang Busko
| Certain ICs cannot be place by our pick and place machines and therefore operators place them by hand. Has anyone seen some type of dispensing material handler that would ensure we don't bend the leads of this fragile devices? I'm envisioning some
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Tue Aug 24 15:10:25 EDT 1999 | Earl Moon
| Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. Electr
Electronics Forum | Wed Aug 25 10:49:42 EDT 1999 | Boca
| | Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. Elec
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Fri Aug 20 12:18:11 EDT 1999 | Earl Moon
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Fri Aug 20 12:54:11 EDT 1999 | Carol Zhang
| | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | Can any one tell me what I have to change in my SMT | | process (paste, reflow, etc) If any? | | I ran one
Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
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