Electronics Forum: advance (Page 88 of 243)

Bga question??

Electronics Forum | Sun Jun 12 19:22:52 EDT 2005 | techknow..

When examining a Bga using an Ersascope, I found that all the joints where good. However I found that the first few solder balls from left to right ( vice versa ) seem higher than the middle solder balls. It appears that the body of the part is flex

Measuring intermetallic compound

Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia

Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is

tape splicing pros and cons

Electronics Forum | Wed Sep 21 10:11:12 EDT 2005 | gregp

Hi Rob, I'm not sure I know what you mean. Are you referring to adding leaders to cut tapes in order to minimize component loss? Also, I've never heard of tapes snapping. Is this something you see regularly on a particular piece of equipment? Th

Mydata TP11

Electronics Forum | Wed Sep 21 12:12:24 EDT 2005 | vikkaraja

HI there, I have a problem with my TP11 HYDRA HEAD. It is not picking up parts from the magazine. I have been working with Mydata on this issue, but I have not had much success so far. So far I done the followings:ran vaccum test, tube height, and H

DEK 2D Inspection

Electronics Forum | Mon Oct 03 09:19:10 EDT 2005 | John S.

We've been using Horizon 01's for a couple of years. We use the advanced 2d board and stencil to setup process control through QC-Calc. It works very well, but you must put the time into setting it up. Ask DEK if they can get you a manual for thei

Inspection Criteria for Silver Epoxy

Electronics Forum | Mon Oct 03 17:57:36 EDT 2005 | Andrea

I am wondering if anyone can direct me to some resources that would help my team define some ispection criteria for silver epoxy. We are using the epoxy on joints as little as 0805. My team has differing opinions on how much is too little and how muc

Lead Free board laminates and surface finishes

Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol

Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar

limitation's of the QSA 30 machines

Electronics Forum | Thu Dec 08 12:06:29 EST 2005 | derengmao

Thank you for the info. I changed the "Light Cntl = 2" into "=1", the system tells "Vision not Init" but the machine works. If change to "= 0" then system tells more problem, and does not work. Do you have better idea about it? For feeder for 040

DEK 265

Electronics Forum | Wed Dec 07 14:20:29 EST 2005 | Robert

I had a DEK 265LT with error code: motor comms failure.card 1, Axis123 fatal error-reinitialize machine during machine boost up I replaced new card 1 and still get the same error. Any suggestion would be greatly appreciated Thanks in advance, Rober

how do you say this in english?

Electronics Forum | Wed Jan 04 07:15:51 EST 2006 | sophiaxiafei

I come from China. And we are Metal stamping dies maker. We have exported dies for FPC products to Malaysia. But i still don't know what do english speakers call the stamping dies for FPC products. Can you tell me what keywords you will use when se


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