Electronics Forum | Tue Jun 08 23:17:47 EDT 1999 | Scott Cook
| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a
Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F
| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1
Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens
In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot
Electronics Forum | Thu Jun 03 18:00:33 EDT 1999 | John Thorup
.020" pitch spacing. Which have yielded my process excelent results. | | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | | Hope this helps. | | | | Deon Nunga
Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Mon May 24 13:06:12 EDT 1999 | Deon Nungaray
| | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing them o
Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Mon May 24 04:01:10 EDT 1999 | Joe Manzur
John, We are using a well known solder paste, begining with the letter "H". (I don't want to be accused of advertising). Also, we are now using a board inverter. In the early day's however, before we purchased a board inverter, we were having to
Electronics Forum | Mon May 17 10:17:23 EDT 1999 | Chrys Shea
| Hi Chrys! | | I've also heard stories of the water-based material "attacking" the inner workings of their spray nozzles - probably due to the water hanging around parts and corroding them. | | Did you have any such problems with the USI ultrasoni
