Electronics Forum | Fri Jun 15 13:06:15 EDT 2001 | CPI
I Agree with Dave, Check spec on cap some devices have temp constraints (can exceed x degrees for more than x time or can not exceed a certain ramp rate). Check that then go through the rest of the process chances are its not your machine if no other
Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave
CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no
Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.
It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le
Electronics Forum | Tue Jan 04 16:20:50 EST 2000 | John
My company is considering purchasing a depaneling press from Pioneer-Dietecs. Our initial evaluation has been very positive; however, in a recent meeting a question was raised about the amount of stress induced in the pcb/components during depanel.
Electronics Forum | Sat Dec 21 12:43:50 EST 2002 | V.RAMANAND KINI
In my opinion its based on the final price advantage you get. And also just because it is cheap to manufacture do not jump to start. See how long your product will sell and what is the product life cycle. There are many mfrs who can offer you reliab
Electronics Forum | Thu Dec 09 17:18:44 EST 1999 | Russ
Ron, I'll bet you have the Ni/Pd finsh on these components! We have had the same problem in our shop. Not knowing the Kester spec. we had to raise the max temp to 220 Deg. C and increase the time above liquidous to 60 seconds or greater. It seem
Electronics Forum | Mon Dec 06 14:56:49 EST 1999 | Russ
The best way that I have found to calculate CPk for placement machines is to buy the kit that is usually provided by the manufacturer of machine. It usually consists of a glass plate and glass components that are scaled. You simply program the mach
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Mon Nov 15 12:27:33 EST 1999 | Wolfgang Busko
Hello everybody, engeneering came up with following problem: Considering worst case the get a temperature at a component (Resistor 0805) of 109�C and 99�C at the solderjoints. As a rule of thump I said that the max. suitable temperature for the solde
Electronics Forum | Mon Nov 01 15:47:21 EST 1999 | Jim Snipes
Dave thaanks for your quick reply. The flow through probelm exists on several component, Examples; small Tan electolic caps.,electrolic epoxy caps. and one specfic lad on a resistor network. I have veried conveyor speed and readjusted heat sett ings
