Electronics Forum | Sat Mar 20 08:37:06 EST 2004 | Primus
The BioAct SC-10 wipes work great, but I've noticed some contamination in our solder joints after I began using them on the stencils. After cleaning the paste off the stencil with the wipes, I started spraying the stencil down with isoproponal and bl
Electronics Forum | Sun Apr 04 10:16:16 EDT 2004 | cyclopsn
I'm involved in backplane manufacturing process. There are about 10 electrolitic capacitor assembled in my board.These capacitor are soldered using a selective soldering machine. My problem is that these capacitor will charged up and failed as short
Electronics Forum | Fri Apr 16 07:34:10 EDT 2004 | Claude_Couture
Ken, thanks for your answer, it is much better presented than what I was fed by our qc. By "calibrating TCs" I meant the readings the controller is displaying on the screen. So that would be the converter that we would check and calibrate. Thank you
Electronics Forum | Tue Apr 27 10:05:36 EDT 2004 | Francois Monette
Hi CT, The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction). Normally you pick the highest
Electronics Forum | Tue Jun 01 16:12:49 EDT 2004 | gregf912
The 10k rebuild does not need to be applied every 3-4 months as previosly stated. A cp machine that is running 100% of the time on a 24/7 basis will tack up 10k hours in 12.4 months. Now we all know that this is impossible due to parts shortages, pro
Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh
Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Sun Oct 10 13:01:46 EDT 2004 | Johnathan
Hello I am a businessman located in Atlanta Georgia USA. The name of my business is Techmania. We area a technology sales and service company. What do you think of the possibilities of purchasing from European and Asisn manufacturers the parts near
Electronics Forum | Tue Oct 05 10:38:43 EDT 2004 | palmerg
Major Japanese OEMs investigated numerous lead-free alternatives, including alloys containing bismuth and/or zinc, such as Sn/Ag/Bi/Cu, Sn/8Zn/3Bi and Sn/58Bi. However, over time, the Japanese industry has moved toward Sn/Ag/Cu alloys. The Japan Elec
Electronics Forum | Tue Oct 12 19:02:20 EDT 2004 | stefwitt
It is being done. I�ve lived and worked in 3 countries, have visited all countries in Europe, been in Asia and most of the US. Japanese are in love with robots and automation. Japan has already moved most of their manufacturing out of China, while US
