Electronics Forum | Fri Nov 07 16:00:45 EST 2003 | Don A
It would depend on how many boards and parts you need to build. I would prefer an etch cut as it leaves the the part intact and you get the strength of the solder joint. It also reduces the handling of the BGA and associated damage from that
Electronics Forum | Mon Nov 17 19:15:24 EST 2003 | Victor
I currently have an inventory of trim caps that have oxidation on the leads. I performed a dip test and am averaging 90% wetting on the leads. On product that has these components already installed is there any risk leaving the parts that have oxid
Electronics Forum | Wed Oct 13 16:24:32 EDT 2004 | shane beard
Every BGA that I have mounted has some degree of scaling in the solder joints. Is this due to a lack of peak temp? Anyone out there have any ideas?
Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony
I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony
Electronics Forum | Wed Nov 03 09:59:47 EST 2004 | Simon UK
Hi Dennis, I would say that you must meet one of the acceptable critera if you have others list, but it depends. Do you have a specific query in relation to a solder joint or other defect?? Simon UK
Electronics Forum | Fri Nov 19 13:46:14 EST 2004 | Dreamsniper
I used ASSCON VP450 with Galden 205 Fluid. It worked fine. Good Solder Joint Quality. I'm not promoting the product just sharing what I had.
Electronics Forum | Wed Dec 08 11:29:48 EST 2004 | Marcus
Hi, champagne voiding is the term for small flux enclosures in a solder joint. Under X-ray that looks like the bubbles in a champangne glass. Marcus
Electronics Forum | Tue Dec 14 08:01:14 EST 2004 | paul_fisher
Our paste is no new we have used it before [Cobar no-clean paste]. The solder joints look like they are bursting out salty looking crystals. Maybe the board cleaning is a red herring in that if the boards are clean it stops this crystalisation travel
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Sun Apr 03 00:40:35 EST 2005 | Dhanish
What is the recommended stencil aperture opening ,stencil thickness and aperture shape for CCGA?We are seeing high reject for Open solder joint.
