Electronics Forum | Fri Aug 24 01:25:58 EDT 2018 | cupet
Hi everybody, please advise in case of soldering problems after the reflow soldering. The problem occurs randomly at different locations on different PCB's (not the complete surface of the board). These places are very difficult for rework. Could you
Electronics Forum | Mon Aug 11 10:40:18 EDT 2008 | realchunks
Try tinning a few parts by hand and place them into the paste and reflow. If they solder fine then, you have a plating problem. Common sense goes a long way.....
Electronics Forum | Tue Nov 14 19:53:31 EST 2006 | davef
More information please. Tell us about: * Board solderability protection * Your process and materials * Breadth and scope of the problem
Electronics Forum | Mon Oct 15 08:24:24 EDT 2012 | scottp
You could pay the extra to have the microvias plated shut and planarized. If your voids are larger than 25% of the BGA joint area then I would suspect a solderability problem. Either the board plating or a solder paste problem. If they're less tha
Electronics Forum | Wed Oct 09 16:43:50 EDT 2002 | mjz289
Kester 256 has also worked tremendously well for us. We have soldered thousands of BGAs from 156 balls to 780 balls .8mm pitch with no solder problems (shorts,opens or voids) and no residue problems. Give it a try.
Electronics Forum | Wed Aug 26 18:58:07 EDT 2009 | rossi
I am not sure that it is the pillow problem. With the pillow problem you tend to see residual solder on the pad and voids where this solder pulled from on the ball. What we are seeing is a very thin flat layer of solder on the pad and a flat surface
Electronics Forum | Mon Jun 14 07:23:42 EDT 1999 | Vinesh Gandhi
We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre to
Electronics Forum | Tue Nov 01 09:57:18 EST 2005 | Chris
Hi, I am experiencing cracked solder joints on ceramic resonators after the ultrasonic plastic weld process. PCB assy is placed into plastic housing and then housing halves are ultrasonic welded. Not a soldering problem. I know this component is
Electronics Forum | Thu Jun 12 04:54:45 EDT 2003 | ronih
I need active solder paste to overcome solderability problems - I believe it have to be washed out, the issue is not the cleaning process only the paste (flux) activity level.
Electronics Forum | Mon Aug 29 10:18:14 EDT 2005 | Just a Viewer
Hi, Wanna to know if you have extra boad (Solder Sample) and extra parts to waste ??? If so, place the parts in all different angle on your solder sample boards... see what going to happens ???
