Electronics Forum | Mon Aug 23 14:49:36 EDT 2004 | msjohnston1
I have no experience working with the systems you listed about, however I have experience working with a GSI Lumonics SVS systems measuring solder paste. I am also in the process in looking for new equipment to replace the GSI systems that is capabl
Electronics Forum | Mon Feb 07 09:03:15 EST 2005 | Chunks
This paste does tend to solder ball - but short of changing paste you can change your stencil to accommodate it. First, why 10 mils? Seems very thick. What size parts are your working with? Typically you can �homeplate� the R�s and C�s and this
Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
Electronics Forum | Tue Feb 08 10:55:56 EST 2005 | Dreamsniper
Hi, Can you guys give me a heads up on "Traceability". I find it to be a stumbling block in my process and delays my manufacturing throughput big time. I wanna have a clear understanding of when you need it, why you need it and how will you benefit
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen
I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w
Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian
| Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation
Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
