Electronics Forum: 2007 (Page 10 of 527)

LLL Driver area error ( Fuji FIP3)

Electronics Forum | beta |

Tue Jan 02 02:32:06 EST 2007

Reflow Problems

Electronics Forum | Wed Jan 03 21:31:16 EST 2007 | davef

Your component leads are getting much hotter than the pads on your board. Slow down the conveyor.

I'm looking for a solder bath (Electrovert minipak 300)

Electronics Forum | Wed Jan 17 15:17:19 EST 2007 | jsloot

We have a minipak for sale. Please contact me

Pin In Paste IPC Guidelines

Electronics Forum | Wed Jan 03 21:19:39 EST 2007 | davef

Use IPA-A-610

Pin In Paste IPC Guidelines

Electronics Forum | Thu Jan 04 09:55:51 EST 2007 | slthomas

I think Mr. Fish has been dipping in to the IPA again.

Board Baking recommendations

Electronics Forum | Tue Feb 20 21:43:24 EST 2007 | sbkwak

Is there any technical reason why OSP finished PCB should not be baked? Your advice will be very much appreciated

BGA adapter boad?

Electronics Forum | Mon Jan 08 09:31:55 EST 2007 | Cmiller

Russ, what kind of pad sizes, spacing do you use? Thanks!

Who is responsible for backing up programs on machines?

Electronics Forum | Fri Jan 05 12:27:06 EST 2007 | james

Just wondering who is responsible to backup programs at your facility? and how often?

reflow oven problem

Electronics Forum | Sat Jan 06 08:29:08 EST 2007 | davef

There may be a coating on the components that fell-off that prevents the glue from bonding well to those components.

reflow oven problem

Electronics Forum | Sun Jan 07 23:26:27 EST 2007 | KEN

I had the same problem. However, now that I switched to crazy glue the parts stay on the board.


2007 searches for Companies, Equipment, Machines, Suppliers & Information

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