Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Thu Aug 08 11:58:25 EDT 2013 | rway
I am not that familiar with the older systems. The software should be supported on both old and new alike unless you are limited by the operating system, but the camera will obviously have a lower resolution and perhaps the filtering is not quite as
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon
PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w
Electronics Forum | Fri Sep 24 09:49:53 EDT 1999 | C.K.
Hi Folks: We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. The bridging is happening after coming out of reflow...one last thing t
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Tue Apr 06 20:28:41 EDT 1999 | Scott McKee
| I need help in finding solder paste measuring equipment. | Height, length, width, area, volume after printing (off line): 1. Cyberoptics:1-800-745-6315 www.cyberoptics.com 2. Manix Manufacturing 1-215-953-9797 3. Theta Group 1-205-650-0535 4.
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