Electronics Forum | Tue Dec 14 10:26:48 EST 2004 | patrickbruneel
Yep that is a tough environment and no-clean will not work. The only two solutions you have is cleaning with a better cleanable paste (No-clean doesn't clean very well) Or you can go to no-residue and skip the cleaning. If you want to further discu
Electronics Forum | Wed Mar 04 11:47:42 EST 2009 | patrickbruneel
I have to correct something from my previous post (before someone else corrects me). You can grow dendrites from any conductive surface (Cu, Ni etc.) but the final stage would be lower SIR. In my experience other metals except for tin do not lead to
Electronics Forum | Sat Jul 28 10:51:38 EDT 2001 | nifhail
I'm curious over what would happen if we continue to use the WS paste when dealing with uBGA. Definitely the cured flux under uBGA package couldn't be cleaned/reached and as I understand correctly they are corrosive. if that so, how long do you guys
Electronics Forum | Mon Jun 21 12:03:20 EDT 1999 | Scott Cook
Since Vic posted me privately and asked for the SIR test parameters I spoke of in my other post, I thought I'd respond on the forum. Ok, here they are, per Joe Keller--Solder / process consultant AKA Manko..... This is an accelerated SIR / dendrite
Electronics Forum | Mon Oct 06 10:04:29 EDT 2003 | davef
Excess low residue flux is very dangerous to leave on your finished assembly, because it can: * Be corrosive to your solder connections * Promote dendrite growth. To prevent this, follow your supplier's recommendations on: * Applying the proper amou
Electronics Forum | Sun Nov 21 21:40:13 EST 2004 | John
I'm experiencing an impedance breakdown on an 0805 ceramic cap. In the application, the cap is at a 16V bias at all times. The unit failed in an extremely high humidity condition. We are using a NC flux and have determined there was flux underneat
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Wed Feb 20 08:57:13 EST 2008 | tonyamenson
We test for board cleanliness using an ionic tester. It's been my experience that if your board is clean you take away the possibility of growth even if the unit encounters moisture. We actaully had a problem where our wash lost pressure due to a mi
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
Electronics Forum | Fri Jun 07 12:34:30 EDT 2019 | teejsd
C3 just uses heated DI water that it applies, then pulls back into a disposable cartridge. Machine then applies a 10V charge to the sample & measures leakage current(nA,I think) over time(sec). If the leakage current is high enough/fast enough, you
