Electronics Forum | Mon Aug 09 10:16:40 EDT 2004 | davef
Look here: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7509&mc=10
Electronics Forum | Tue Aug 31 11:21:23 EDT 2004 | burgosa
Thanks for your input. Have you or anyone considered CyberOptics SE300? How does it works for small solder paste deposits (i.e. 0201)?
Electronics Forum | Mon Apr 04 09:30:49 EDT 2005 | russ
Andrew, we need a lot more information to help. 1. what is the open caused from? bemt pins, non-wetting, board bowing, or no paste deposited. 2. What is your current stencil design? 3. What does this connector look like and what are the pins? Rus
Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont
Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD
Electronics Forum | Wed Feb 22 10:32:37 EST 2006 | amol_kane
you could do a capability analysis on the printer.....setup the printer with your print parameters and select a metric (say paste volume deposited) and find out Cp and Cpk values
Electronics Forum | Fri Feb 24 06:42:08 EST 2006 | SIR
What is the IPC norm wich drives the IPC stencil aperture design? The contest is: a stencil for the deposition of solder pastes on bare boards Thanks
Electronics Forum | Thu Mar 16 10:04:41 EST 2006 | slthomas
"better gasketing, less dog-earing" I suppose gasketing could contribute but my assumption is that it's a function of better shearing action between the blade edge and the aperture wall. You get a more consistent shape on the top of the paste deposi
Electronics Forum | Tue Jul 18 05:52:24 EDT 2006 | sant
Check the Bare PCB lot. Enquire about the HAL process for Tin deposition while PCb fabriction.
Electronics Forum | Fri Oct 13 06:44:18 EDT 2006 | Matt Kehoe
Solid Solder Deposit may work www.sipad.com mk
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
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