Parts & Supplies | Pick and Place/Feeders
We have 30pcs each of Fuji NXT H04S head original new nozle dia. 5.0 and 5.0G for sale. Fuji NXT H04 Head Nozzle, AA06W00, FUJI NXT H04 Head NOZZLE Dia. 1.0 AA06X00, FUJI NXT H04 Head NOZZLE Dia. 1.3 AA22Y00, FUJI NXT H04 Head NOZZLE D
Parts & Supplies | Pick and Place/Feeders
We have H01 Head in our stock, the head and nozzles are new never used. If you are interested please let me know. UH006A00 H01 Placing Head (with Chuck for Automatic Backup Pins), 1 pcs UL01500 H01/H02 Nozzle Station , 1 pcs AA0AS00
2AGKNX005100, NOZZLE FUJI NXT Head H24 Dia. 0.3 2AGKNX005200, NOZZLE FUJI NXT Head H24 Dia. 0.35 2AGKNX005300, NOZZLE FUJI NXT Head H24 Dia. 0.4 2AGKNX005500, NOZZLE FUJI NXT Head H24 Dia. 0.5 2AGKNX003100, NOZZLE FUJI NXT Head H24 Dia. 0.7 2AGKNX003
Crane bar solder are made from gradeA Virgin metals Bars:1/4,1/2and1 Lb. Cakes-3 lb.4"dia. Ingot or pig-50 lbs.Ribbon .oo2 to .125"T in W to4" Wire solid to flux cored sizes .500dia-.005Dia
Industry Directory | Manufacturer
BLIND RIVETS,BLIND NUTS,BLIND RIVETING TOOLS,STAINLESS STEEL CABLE TIES
Used SMT Equipment | Drying Equipment
Tenney Temperature Test Chamber Model T30C Internal Dimensions: 36"W X 40"D X 36"H External Dimensions: 59"W X 63"D X 77"H Temperature Range: -70 to +170 Deg. C - Air Cooled Programmer, Over and Under Temperature Pro
Model GBW-60 Computer Control Cupping Testing Machine Applications: The Cupping testing Machine (Erichsen Tester) is precise technology testing machine which is used for thin sheet metal & strip steel rolled stock etc. It can complete test of pl
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
