Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
Electronics Forum | Fri Feb 23 15:22:42 EST 2001 | micah
Can anyone recommend a good software package which can be used to create panel criteria from Gerber/Cad data. Needs to do more than step & repeat. Need to be able to define panel size, add panel fiducials, define breakaways and hole sizes, ability
Electronics Forum | Fri Jul 01 04:15:58 EDT 2005 | pci
Hello I am looking for a best solution to make a prototype of Single sided and double sided board. Using Orcad. The line / track width are 8/8 mil. the hole sizes are 0.6 0.8 , 1.2 and 2.6 mm. The size will be approx. 175 x 130mm. Could you please
Electronics Forum | Sat Aug 28 11:03:44 EDT 2004 | mariels
We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks
Electronics Forum | Wed Feb 09 10:20:26 EST 2000 | Sal
Currently we have started seeing an issue around a scuzzy connector.The problem being that during insertion of this connnector a couple of pins refused to be inserted and as a result fold over, this folding of the pin is causing the pin itself to fra
Electronics Forum | Tue Aug 31 17:53:02 EDT 1999 | Dennis_F
| | | | | | Planning to evaluate the above process... | | | | | | Can anyone can give me some tips/infos on the above.... | | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, i
Electronics Forum | Wed Nov 10 15:18:15 EST 2004 | Dave G
Let's go for Ugly..... I've used these in the past for attaching connectors to boards and tabbed Transistors to extruded Aluminum heatsinks with mixed results. The concept is great but, in practice there are some headaches to deal with. We've gotten
Electronics Forum | Sun Jun 04 07:37:57 EDT 2000 | Dreamsniper
CK, just curious...is the via located close to a pad or land? if yes, what's the gap between the via pad and the component pad/land edge ? what's the Via hole size? Have you checked where does the solder that bleeds out of the via come from? Please
Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng
Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea
Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
