Electronics Forum | Wed Jun 13 21:30:23 EDT 2001 | davef
We use a great concensus document for inspection. It is: IPC-A-610C, Acceptability Of Electronic Assemblies as the basis for accepting assemblies. You can find it at IPC [http://www.ipc.org]. [Help!!!! I�m turning into an IPC Cal.] We find that m
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Thu Sep 30 10:30:11 EDT 1999 | Chris May
I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to achieve
Electronics Forum | Tue Mar 16 20:29:27 EST 1999 | Bob Bartolotta
In Section 5.1 Flux Residues, 5.2 Particulate matter 5.3 Chlorides and Carbonates & White Residues, I am assuming that these boards have been through some type of cleaning step. Hot water, saponifier, air dryed and the pictures illustrate unacceptab
Electronics Forum | Wed Oct 24 09:11:54 EDT 2001 | John S
Does anyone have any guidelines or IPC standard they can suggest for specifying the type of solder mask used? We've started having problems with poor masking, and when I asked our designers what they use as a specification, they can't give an answer
Electronics Forum | Fri Jul 11 12:37:23 EDT 2003 | Lake
We bought a VI Technology machine about 7 months ago. It's done a great job for us on military product (SMT cards - IPC A 610 Class 1 and 2). Results are only as good as the programming being done. Take a look at it (talk to them) and make a decisio
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Mon Feb 07 14:54:30 EST 2005 | davef
Industry assembly procedures say: * ANSI/IPC-A-610, in section 3.4.1, as a guideline, indicates that "There must not be any eating, drinking, or use of tobacco products in the work area." * ANSI/J-STD-001, in section 3.7, "Eating, drinking, and/or u
Electronics Forum | Tue Feb 21 20:14:50 EST 2006 | Joseph
Dear all, Recently our lead-free samples being rejected due to very dull and sometimes grainy and very porous surface on solder joints. This samples was flow thru' the lead-free wave soldering with SN100C alloy composition. Referring IPC-A-610 D, le
