Electronics Forum: printer fuji (Page 10 of 11)

Re: Need to spec in smt prototype equipment

Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry

If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s

Quad Machines? Good Points / Bad Points

Electronics Forum | Tue Apr 23 12:17:28 EDT 2002 | binns

I have a couple of questions for you, and a couple of answers. 1. Which model ? (100, IIc, IVc, QSV, QSP ) 2. In reference to how the machine stacks up with Fuji and Panasonic. They have never stacked up. Those families of machines have historicall

Need help on selecting the SMT equipment for small volume

Electronics Forum | Thu Jul 21 03:54:39 EDT 2005 | Rob

Never thought I'd hear myself say this (& I will punish myself later). Whatever you do, don't buy an AP25, CP4 or IP2 for starting out in low volume. 1) You will need a LOT of space 2) You will need a very good constant air supply else the AP25 wil

Re: Set-up times

Electronics Forum | Wed Oct 28 01:17:57 EST 1998 | Earl Moon

| SMT-ers | | I notice that most suppliers provide data that is eye-catching but avoid providing data of significant technical relevance, such as Cp and Cpk. It would perhaps be a wise idea for standards to be formulated in this area. | For

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Selecting pick and place machine (comparison/personal experience/sales pitches)

Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd

I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350

Where do I Start?

Electronics Forum | Thu Sep 12 08:22:30 EDT 2002 | caldon

YOU think I could let this posting go by with out a reply??? PLEEEEASE. Genny- No matter what direction you go do your home work. This will require a lot of home work on you and your staff. If you go the contract manufacturing route GREAT!!! But hav

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

Flason SMT Products

Electronics Forum | Thu Oct 04 00:00:58 EDT 2018 | gaintstar

Flason SMT Reflow Ovens: http://www.flason-smt.com/product/China-Reflow-oven.html http://www.flason-smt.com/product/China-Samsung-EXCEN-PRO-High-Speed-SMT-Modular-Chip-Mounter-agent.html http://www.flason-smt.com/product/China-Samsung-SM321-High-Spe

Re: Component Packaging Trends

Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc

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