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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_leaded-horizontal-to220-pad-association_topic892.xml
. All goes fine with the creation within the tool graphically, but when I import it into my PADS library (ver 9.3.1 if relevant) the 4 th pin does not have the large thermal pad associated to the hole (see image
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/leaded-horizontal-to220-pad-association_topic892_post3292.html
. All goes fine with the creation within the tool graphically, but when I import it into my PADS library (ver 9.3.1 if relevant) the 4 th pin does not have the large thermal pad associated to the hole (see image
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/leaded-horizontal-to220-pad-association_topic892_post3292.html
. All goes fine with the creation within the tool graphically, but when I import it into my PADS library (ver 9.3.1 if relevant) the 4 th pin does not have the large thermal pad associated to the hole (see image
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/leaded-horizontal-to220-pad-association_topic892.html
) the 4 th pin does not have the large thermal pad associated to the hole (see image). I also noticed that graphically the large pad shows as expected (see image
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic892&OB=DESC.html
. All goes fine with the creation within the tool graphically, but when I import it into my PADS library (ver 9.3.1 if relevant) the 4 th pin does not have the large thermal pad associated to the hole (see image
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pad-stack-name-for-through-hole-parts_topic1432_post5758.html
. IPC uses the Pad Size to calculate Thermal Relief and Proportional uses the Anti-pad to calculate the Thermal Relief. The big difference is that the Anti-pad is a much more stable number because it's calculated by the hole size which is always consistent