SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy Dual printing stage that furthers productivity: High-speed production Printing the same product on the front and rear printing s
New Equipment | Board Handling - Pallets,Carriers,Fixtures
With MB Manufacturing’s continuous improvement strategy we have developed the ultimate selective solder fixture out of a combination of titanium and composite, incorporating the latest in flow technologies to eliminate skips and bridges on a selectiv
SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell Phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy Features that enable high productivity and stable quality Hybrid squeegee head Hybrid squeegee head, which has a good track rec
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Stentech has advanced capabilities in machining and drilling composite materials. Stentech can provide a wide range of manufacturing solutions for wave solder pallets that are custom-engineered and manufactured to each client's specifications. The u
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
The Polyonics polyimide tapes combine the unique electrical, thermal, chemical and mechanical properties found in polyimide with Polyonics proven coating, adhesive and manufacturing technologies. The tapes maintain these excellent properties over a w
Material: Aluminium Layer Coverage: 1Layer Thickness: 1.6mm Surface Technique: HAL Line Width/Space: Solder Mask Color: Black silk screen:white We sincerely hope to establish longtime and friendly business relationship with you. Good quality, re
Material: CEM-1 Layer: 1 Thickness: 0.8mm Surface treating: Pb free HAL Solder mask: Green Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Sample 3 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test We are always
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
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