Industry News | 2013-10-31 11:53:09.0
Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2009-07-14 17:50:29.0
Carlsbad, CA – July 14th, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14th and 16th July at booth 743 in the South Hall.
Industry News | 2013-06-03 11:00:12.0
The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.
Industry News | 2017-07-07 17:15:03.0
Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).
Industry News | 2002-07-30 15:53:01.0
July 30, 2002
Industry News | 2012-04-24 06:53:22.0
April 24, 2012.Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.
Industry News | 2012-04-24 08:13:12.0
April 24, 2012 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.
