Electronics Forum | Fri Jul 02 03:51:14 EDT 2004 | HARAN
I was told by my boss that the new product will be transfered to my facility will have the Super BGA and Hyper BGA.Can I know what is the difference of these 2 components compared to normal BGA.Is there any difference in the assembly process and requ
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Mon Aug 14 03:52:39 EDT 2006 | Richard Robins-Bird
Visit http://www.fujismt.com Most of our splicing tapes do not require specialist tooling or splicing plates.
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Fri Feb 13 16:13:20 EST 2009 | jax
Many shops require levels for typical component packages on FR-4 or a like substrate to be 2, 9, 15, 1 and 10 mg/in2 for fluoride, chloride, bromide, nitrate, and sulfate respectively. These levels can change for Medical or Automotive.
Electronics Forum | Sat Feb 14 08:21:13 EST 2009 | davef
We believe that it's perfectly resonable for you to define the cleanliness that you require. We recommend that you leave it at that and not define the process or materials that your supplier use in meeting that cleanliness level. Start with a dirty
Electronics Forum | Thu Feb 11 20:36:18 EST 2021 | tsauve
1.Yes but you want specific SPI & AOI machines. Same manufacturer can provide both. 2. Yes but not as well as an SPI machine. 3. Don't understand question. 4-7 You should do your research, or hire someone with the expertise you require.
Electronics Forum | Thu May 13 16:55:51 EDT 2021 | emeto
With Pb-Free HASL you can't use Pb process for sure as the melting point of tin is so much higher than the lead paste process. SAC305 is the most popular compound, unless your assembly requires something else for a specific reason.
Electronics Forum | Thu Jan 18 07:22:10 EST 2024 | klauss
Is there any stardarts to help us what tolerance values (max or min. height, weight, volume etc) should we use while programming AOI and SPI.
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
