Electronics Forum | Mon May 24 19:37:57 EDT 2010 | jry74
I am new Engineer in conformal coating and I am looking for help with dewetting. What "Tricks of the trade" can I try to reduce or eliminate dewetting? We use a lot of Conap CE 1155 and Humiseal 1B73? Any help would be appreciated!!!
Electronics Forum | Mon May 24 19:38:33 EDT 2010 | smt_guy
Has anyone here specially the Gurus heard, used or seen a Reflow Oven with Vacuum? Is the result really good when it comes to reducing Voids? Can you share any info about this oven? thanks and regards...
Electronics Forum | Tue May 25 13:30:38 EDT 2010 | nikopolidis
HI Please Advice witch material can stand more heat FR4 or CEM3. PCB assembly will be used under the body of toaster Temp. range 90°C Could anyone tell me the difference in PCB material For imcoming quality control. Thanks & regards Fotis
Electronics Forum | Wed May 26 12:20:38 EDT 2010 | emrtech
we are currently running 0201 components using the c-14 tool on the my9 pick and place and are having a lot of missing components with in the PCB's. is anyone or has anyone had this problem? if so, were you able to finf a fix for it?
Electronics Forum | Sat May 29 11:51:22 EDT 2010 | davef
Louie & Sibbe: If that's what you're aiming to accomplish, why aren't you investigating used dispensers?
Electronics Forum | Fri Jul 23 03:25:43 EDT 2010 | cobar
Please wash the PCB`s before conformal coating.Do you use deodrant before or after you shower??????
Electronics Forum | Fri Jun 25 13:56:01 EDT 2010 | tate350
Consider using wavesolder pallets that keep the board flat during wave. Keep the board in the pallet after wave until it cools down a bit then remove it.
Electronics Forum | Fri Jun 25 22:30:47 EDT 2010 | smthexi
i think you need to use a PCB central support. do you know that part ? it specializes in preventing PCB board from bowing during wave soldering.
Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Mon Jun 21 02:15:03 EDT 2010 | ppcbs
We also encountered the crack case in multi layer Ceramic Cap,0603 after touch up. Most failure were on the terminals. Previously, we used 0805 instead 0603.that time, failure were very few.
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