Electronics Forum | Mon Oct 09 21:17:24 EDT 2000 | Dave F
I don't get the no-lead thing, but it's good marketing so, whose to fight it? Yano? If I didn't get the no-lead thing, I'm double clueless about bromine. That is until I read a recent (8/00) article in PCFAB magazine. I away thought of bromine as
Electronics Forum | Sat Sep 30 11:59:30 EDT 2000 | jarnopy
Hi! What kind is perfect smt line? It's difficult question. First you must know what kind your production is. Do you have a serial production or do you have a lot of proto series? If you have only few different pcb then you must get placemant machine
Electronics Forum | Fri Aug 25 10:27:49 EDT 2000 | Earl Moon
Who are you? Or are you the forth person in the past year who contacted me by email to whom I responded in kind some minutes ago? I'm not back until this mess gets at least a little organized, with some technical substance beyond that which I have s
Electronics Forum | Thu Apr 27 05:16:42 EDT 2000 | Wolfgang Busko
Despite the fact that one might get the "solution" set up in place there�s no guarantee that there�re no problems for you. I wouldn�t give to much of the decisions out of hand, I would have my own responsible people in the taskforce to accompany and
Electronics Forum | Tue Apr 17 10:17:10 EDT 2001 | genny
Hi, ENIG finish is the same reason I came to this forum for the first time a few months ago. I found a bunch of useful information by searching the archives. Check it out. ENIG has some good properties like flatness, and the process control has i
Electronics Forum | Mon Apr 23 22:48:50 EDT 2001 | davef
Cal is correct. Sipad, Precision Pad, Optipad, SSD, and all that were a feeble Euroland approach to creating flat pads for fine pitch assembly. To begin with, they required a complete board redesign using their proprietary software. [Oooo, me firs
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko
Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se
Electronics Forum | Mon Dec 06 12:26:04 EST 1999 | Wolfgang Busko
Hi Greg, why don�t you see it this way: How many parts get lost ( consider the type and packing (reel, stick, tray ))loading the machine or replacing it. - This is the amount you should add for each job. How many parts are rejected or discarded by th
