Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon
Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre
Electronics Forum | Thu Nov 04 04:27:46 EDT 2010 | d0min0
thanks for all the feedback... we also checked, just in case : - bake the components (no visible improvement) - bake the pcb (50% less tombstone components) - finally we changed LF paste to completely different manufacturer - and booom 0 (zero) tombs
Electronics Forum | Mon Jan 10 18:08:29 EST 2011 | eadthem
vpblf I actually installed the Uniserver (apache mysql php) WAMP on the AOI machine and there is a setting to make it generate HTML board results, cant remember where off the top of my head. anyhow anyone in the inspection area can now open firefo
Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp
Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert
Electronics Forum | Wed May 25 17:56:24 EDT 2011 | rssimmons
The SimmScope is an first article inspection system that uses an overhead digital microsope on a motorized gantry to inspect the board - much like an AOI - except that it does not automatically make the pass/fail decisions. It is up to the operator t
Electronics Forum | Thu Jan 06 10:49:18 EST 2011 | ercdave1
Thank you guys for the help. Tom, i got the manual and as far as i can tell there is a lot of reading i need to do. Also got the MCH file but i do not have any idea as of how to imput to the machine. i will read the manual hopefully some of my ques
Electronics Forum | Tue Jan 11 13:28:14 EST 2011 | jmw
0603 and up should be no problem on the machine. If you are doing under 25 mil pitch the machine needs an upward camera to repeatably place the parts. You will always lose the first 10 or so parts with cut tape but that should be about it. Repair par
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson
You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented
