Electronics Forum: solderers (Page 952 of 2099)

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Mon Jun 19 04:42:37 EDT 2006 | Loco

There are plenty of studies on this subject. If the BGA can handle the extra temperature and they are soldered on a leadfree profile, the general result seems to be a better reliability than Pb :) Just out of the top of my head, there was a link to

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 13:02:49 EDT 2006 | grantp

Hi, That was another very interesting article posted. This article seems to point to the same conclusion, which is that lead free soldering is more reliable than Pb components with Pb paste, and Lead Free components with Pb paste? From what I see,

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds

Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.

%RH in the Production Hall

Electronics Forum | Mon Jul 17 11:19:46 EDT 2006 | Chunks

Never seen a direct study on these two correlation�s before. But if you have moisture sensitive devices, higher humidity could have some affect on them. If you are talking regular Rs and Cs over wave solder - I kinda doubt it. Water based fluxes d

pcb manufacturing

Electronics Forum | Fri Jul 28 08:08:18 EDT 2006 | Chunks

Screen printer, placement machine(s) and oven. You may also need a hand insertion line, selective solder or wave soldr and some form of electrical test. There are a ton of name brands that no two people can agree on. To get a better feel for what

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 09:40:11 EDT 2006 | pavel_murtishev

Good afternoon, 1. Yes, most of all I suspect the components. Could you explain what does mean "reflothermal recipe"? Ramp-to-spike? Ramp-soak-spike? Something special? Thanks. 2. Void is really huge. This voiding differs from "standard" voiding ef

SAC305 Solder Balling

Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com

I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli

Pcb immersion tin thickness

Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21

Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 07:32:11 EDT 2006 | mumtaz

The curled legs may push the paste out of the hole, making things messy. This also will decrease your volume of paste which means your solder joints are not as robust as you would like. Also with this process, voiding can be a big issue depending o

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG

Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i


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