Electronics Forum | Wed Jun 04 13:40:41 EDT 2003 | caldon
You may have answered your own question. CHEMISTRY, CHEMISTRY, CHEMISTRY depending on what type and whos product will work differently for each machine and Board geometry. I would ask Kyzen, Pertoferm, Zestron, and Aqueous Tech (all Chemistry manuf
Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas
I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it
Electronics Forum | Thu Aug 14 16:36:45 EDT 2003 | Hussman
Anyone using these 2010 resistors? We just tried them and they bow like crazy during reflow. Not very good looking. Profile meets manufacturers spec. The part solders and works fine, but I'm a little concerned about putting anything on a board th
Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Tue Aug 26 14:13:46 EDT 2003 | robd
We have seen "coplanar problems" on BGAs supplied by some suppliers. We have seen large enough spere variation to cause opens with our standard .006" paste process (paste and profile work fine "most" of the time) . Although not an extremely technic
Electronics Forum | Tue Sep 16 09:59:26 EDT 2003 | James
I am having a problem with SOT23 moving off their pads during reflow. We did not have this problem yesterday. On the pads and surrounding area looks like a lot of flux spatter. I looked through the threads but they didnt help me much. I know what 3
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Mon Dec 01 12:33:20 EST 2003 | frank
I see where I went wrong. The numbers provided by "Process Engineer" are correct. My company is trying to adhere to the Six Sigma code of business and the managament here falsely assumed that all of our equipment can do that as well. After doubl
Electronics Forum | Wed Nov 26 10:46:45 EST 2003 | caldon
For a general rough rule of thumb I use Practical Components for programming our machines. Practical has a nice layout of most Tape and Reel components and sizes. We use this mostly for tape/ feeder allocation. But for QC, Specs, and Other Stuff we
