Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Wed Oct 08 08:30:21 EDT 2003 | christ
Hi Dave: I'd second you.Thanks for your effort and can you give me the hints about correct reflow profile for soldering PCBA.I doubt there was something problem during reflow,I found there were some flux residue left on the PCBA after reflow by th
Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef
While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER
Electronics Forum | Wed Mar 13 20:40:02 EST 2002 | davef
Nice maCHEEN, mon. Please explain, �reliably dispensing�. What do you mean? How do measure? How are you sure? Etc. Just as points of reference: * What is the ratio of height to diameter of your dots? * How are you sure that you�re not stringing?
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Electronics Forum | Fri Aug 07 13:30:22 EDT 2020 | emeto
ASM machines have great algorithms for BGA and I am positive it will detect missing ball. Still, on your pictures it seems like you are severely starving solder in the locations shown on X-ray. Part seem too small to bend that much in reflow to form
Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon
| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using
Electronics Forum | Mon Jun 05 14:17:18 EDT 2000 | C.K.
Dream: Yes, VIA's are connected to actual SMD pads via traces - roughly .030" from the pad. The VIA is .013" in diameter, and the excess solder bleeds out of the actual VIA barrel after the 1st reflow.... -CK
