Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Tue Jun 24 12:56:26 EDT 2014 | jmathis
Hello, As our company has begun doing an increase production of contract manufacturing I have seen more and more designs with the 0402 pad layouts that are smaller (.015 in width) than the component. Also there is only a .008 longer than the 0402 p
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Tue Jul 08 10:29:56 EDT 2014 | mleber
We are experiencing FOD coming off of a Cooper Bussman fuse. The components are dark with a metal like substance. In our testing based on what we were seeing we placed components onto a piece of FR4, placed a drop of flux onto the component and ran t
Electronics Forum | Wed Jul 23 05:16:43 EDT 2014 | edriansyah
Hi All... Need your advice on the unit of measurement for solder paste pressure. My current company use SP machine from 2 vendor, both are using different unit of measurement. 1. Yamaha uom N 2. DEK uom Kg Up until now I dont know how to do
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Tue Oct 14 19:11:44 EDT 2014 | caurbach
We have a 6622CC machine for SnPb boards. A few things you may want to try: - Solderability testing on the components/PCB. - If the fuse holders or copper in the board are sucking up all the heat, try increasing preheat. Some fluxes (like the WS f
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Sun Nov 23 20:37:36 EST 2014 | gregp
Hi J_Dub, thanks for the continued info...Of course selective soldering would be very time consuming for such a through hole assembly...but 18 minutes, wow...didn't realize selective soldering could take that long. I would like to know the approxima
