Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Electronics Forum | Wed Oct 11 16:05:16 EDT 2000 | NLykus
Does anyone have any experience with running a double sided/surface mount(bottom)board manufactured with CHEM 1 material? We are currently looking at cost cuts. My personal experience recently in running a D.O.E. against other materials and solder
Electronics Forum | Mon Sep 25 07:35:04 EDT 2000 | Mikel Rodriguez
Hello, We are using FR-2 in boards 15x10cm size, with SMD and thru hole components (about 100 SMD and 50 thru hole). We have some "rare" problems (flex cracks or caps, diodes, and so on). Would we improve something by using CEM-1 instead of FR-2?? Mo
Electronics Forum | Fri Sep 22 07:35:37 EDT 2000 | Henrik Eklund
Hello everyone out there, I have been working in the SMT process for a couple o years now, and now I'm partly responsible for the turret head component mounting process. We are about to buy new equipment and I want to do a capability study of this m
Electronics Forum | Tue Sep 12 20:41:12 EDT 2000 | Dave F
Dunno, but maybe one of these taping contractors can give you an answer: V-Tek 214.479.9442fax1630 Surface Mount Taping 408.954.1400fax1470 Cofer 408.526.2050 KBK Electronics 613 S.Market St Lancaster, SC 29720 800.726.1887 803.286.6416 fax283.4115 A
Electronics Forum | Thu Aug 10 13:30:54 EDT 2000 | Bob Willis
Solder skips on SOT23 parts is the most common issue when soldering surface mount designs. The two most common causes are the wave height too low or there is too much gassing of the flux as it contacts and seperates the wave. Stck some parts on your
Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Fri May 26 13:16:53 EDT 2000 | Todd
I have worked with MPM and GSP (fuji) and the DEK. I have had the least problems with the DEK. Kept having software issues with the MPM although I have heard some having good experiences. We used the GSP for the through hole but needed new vaccum
Electronics Forum | Wed May 17 20:51:34 EDT 2000 | Dave F
Janet: What a great adventure you're starting!!!! For newbies: * Buy Ray Prasad's "Surface Mount Technology" book. * Attend RP's introductory course at NEPCON (or where ever) it's as good as anyone's. * Subscribe to "SMT" and "Circuits Assembly"
Electronics Forum | Tue May 16 06:00:47 EDT 2000 | Wolfgang Busko
Do you have influence on the design process ? Avoid components you are not able to assemble in certain $-limits. A way to put delicate parts on the pcb that your P�n�P isn�t able to place is to add an SMD-manipulator used for manual assembly between
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