Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Wed Jul 07 22:59:06 EDT 1999 | Dave F
| Hi! | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformi
Electronics Forum | Fri Jul 02 14:32:44 EDT 1999 | Dave F
| I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/change
Electronics Forum | Fri Jul 02 14:50:39 EDT 1999 | Earl Moon
| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan
Electronics Forum | Fri Jul 02 16:16:53 EDT 1999 | Scotty
| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Mon Jun 28 15:50:22 EDT 1999 | JohnW
Hey there gang, how's it going ? Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's are only
