TIN LEAD SILVER BGAS

My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product.

1. Is there any long term reliability issues with 2% Ag in BGA Ball.

2. If the PCB finish is ENIG will there be degradation in the reliability.

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