Hello Everybody
I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more information about the following
1. Is there any known difference between the resilience of polyimide passivation and the widely used nitride passivation. In other words is the polyimide passivation less sensitive to scratch damages.
2. Known difference in adhesion of the polyimide and the nitride passivation to different underfill materials.
3. Known difference in moisture absorption characteristics of the passivation materials.
4. Any other known differences
5. What would be the other passivation material widely used in the industry.
I am in urgent need of the above information. Any help would be greatly appreciated.
Regards Susan
reply »