This type of testing is only done to verify your reflow process. It is destructive testing and should not be performed on product reaching your customer. Solder is only used to provide the electrical connection from part to board. As a metal it is very weak. The added benefit from reflow is that it is strong enough to hold the component on the board. It's intent is not strength. Rob�s attachment is a study to determine the break point of various solder joints. This is destructive testing and any product used in the experiment are probably deemed scrap afterward.
As for your inquiring to a peel or push test; you should perform this test on the initial start up of the product. Run a design of experiments to push each process from it�s min to the max and then use visual inspection and IPC as your guide. You can further this experimentation by taking what you deem your worst and best looking solder joints and have them tested by an outside source such as Trace Labs (Sorry conspirators, I�m not affiliated. (Or am I? - Insert evil laugh -)). The outside lab results will confirm your visual evidence. From there you can continue to use IPC as your guide.
If you must comfort an old time gorilla and do destructive testing, you may want to think about using the results from your outside lab. Use their tensile strength as a guide. If you plan to sell the product you test, test a couple of units and send them in for tensile strength. Compare this to virgin product and see if your test is causing possible latent field failures. Also get your tools for poking and prying calibrated. Otherwise anyone with a fish scale can blow holes in your process.
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