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I am in the process of implemeting Through Hole Reflow....
- Feb 22, 2000
Did you have any luck in finding an acceptance criteria that...
- Nov 28, 2001
Through Hole Reflow | 22 February, 2000
Hi, I am in the process of implemeting Through Hole Reflow. 1.I would to know which are the products/Companies that use that use this process.
2. Is there any reference / standard to convince my QA dept. to accept the boards even though there is no fillet on the bottom protruded lead?
3.As per ANSI J STD 001, the through hole should have at least 75% solder joint. How to measure this % in production sample lot and go smoothly without any arguments.
Appreciate your help,
Through Hole Reflow | 28 November, 2001
Did you have any luck in finding an acceptance criteria that QA accepted? We have had excellent results on signal pins of D-sunb connectors but the grounding prongs dod not meet IPC standard 610C, 4.3 Thanks, John
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